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LLT.micro - HIGH PRECISION, UNIVERSAL, MATERIAL FRIENDLY

Laser micromachining is not just about the economic production of very small components. High-precision and gentle processing of sensitive products and materials is also important when it comes to quality criteria in medical technology, microelectronics or the jewelry industry. High-quality and burr-free cut edges are just as essential as the output quantity.

LLT.micro integrates modularity and technologies to meet these challenges. The compact system combines positioning accuracies of up to +/- 3 µm and highly dynamic direct drives with efficient fiber lasers and gentle ultra-short pulse lasers.

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Highlights

  • Micro cutting, welding, drilling, ablating

  • Up to ± 3 µm positioning accuracy

  • Laser micromaching of 2D, 3D and cylindrical components

  • Process area (X, Y, Z): up to 500 mm x 500 mm x 400 mm

  • Fiber and femtosecond laser with fixed optics and galvo-scanner

  • Highest precision and dynamics for excellent machining results

  • Efficient and gentle for delicate geometries and sensitive materials

  • Wide range of applications for cutting, welding, drilling and structuring processes

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APPLICATIONS FOR LLT.micro

SPECIFICATION

Technical data LLT.micro
Applications Laser cutting
Laser welding
Laser drilling
Laser ablating
Processable parts 2D, 3D, tubular parts
Processable material Metals
Polymers
Ceramics
Glass
Polycrystalline diamonds
Semiconductor materials (e. g. silicon)
PCB materials (e. g. FR4)
Processable material thickness Up to 2 mm
Path accuracy Up to +/- 3 µm
Repeatability Up to +/- 1 µm
Process area (X * Y * Z) Up to 500 mm * 500 mm * 400 mm
Movement speed Up to 50 m/min
Laser sources Fiber laser
Ultra-short pulse laser
(Combined operation possible; Standard wavelengths: 515 nm; 1030 nm)
Process optics Fixed optics (in combination with galvo-scanner possible)
Galvo-scanner (in combination with fixed optics possible)
Drilling optics
Load capacity of X/Y cross table Up to 50 kg
Rotation axis (optional) Direct drive
3D-processing (optional) Up to 6 axis
Tilt and swivel axis module
Motorized swiveling processing head
CNC control system Beckhoff
Machine base Granite
Dimensions (W * D * H) app. 1.700 mm * 1.600 mm * 2.200 mm
Weight app. 4.000 kg
(depending on the specific machine configuration)

Options

  • Combination of fiber laser and femtosecond laser

  • Combination of fixed optics and galvo scanner

  • Integration of rotary, tilting, swiveling axes and motorized swiveling processing head

  • Vision system for automatic measurement and inspection

  • Intuitive design of weld paths on live image

  • Pneumatic clamping systems and automatic component handling

  • Filter and cooling systems

     

Control System & Software

  • BECKHOFF CNC controller

  • Ergonomic 22" dual touch screen user interface

  • Handheld control unit for setup work and manual positioning

  • Programming on the machine or at the computer workstation

  • CAD-CAM software for CNC programming

     

PICTURES

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